Feature Requests

Ground fill doesn't connect EP(exposed pad or thermal pad) to GND if your footprint contains separated paste pads(which is almost always for parts with EP). Need more control over paste mask and solder mask layers https://www.loom.com/share/fb033da4d4df425680e13fbd9a8b508e

When updating a part, changes take a long time to propagate to projects consuming the part. This makes it harder to do the process of lining up pins on custom symbols (which is already a cumbersome process). https://www.loom.com/share/3732049bbbc34d0189c4d1ee7dab2294